Formation and characterization of low resistivity sub-100nm copper films deposited by electroless on SAM

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 54, Issue 25, Pages 6053-6057

出版商

Elsevier BV

发表日期

2009-03-12

DOI

10.1016/j.electacta.2009.02.089

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