Void Density Reduction at the Cu–Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer

Published 2010 View Full Article

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Title
Void Density Reduction at the Cu–Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer
Authors
Keywords
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Journal
ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume 13, Issue 12, Pages H412
Publisher
The Electrochemical Society
Online
2010-09-14
DOI
10.1149/1.3487926
References
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