Void Density Reduction at the Cu–Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer

标题
Void Density Reduction at the Cu–Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer
作者
关键词
-
出版物
ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume 13, Issue 12, Pages H412
出版商
The Electrochemical Society
发表日期
2010-09-14
DOI
10.1149/1.3487926

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