Development of Resin Insulated Material with High Thermal Conductivity and Application to the Power Module

Title
Development of Resin Insulated Material with High Thermal Conductivity and Application to the Power Module
Authors
Keywords
-
Journal
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
Volume 28, Issue 2, Pages 169-173
Publisher
Technical Association of Photopolymers, Japan
Online
2015-08-19
DOI
10.2494/photopolymer.28.169

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now