Development of Resin Insulated Material with High Thermal Conductivity and Application to the Power Module

标题
Development of Resin Insulated Material with High Thermal Conductivity and Application to the Power Module
作者
关键词
-
出版物
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
Volume 28, Issue 2, Pages 169-173
出版商
Technical Association of Photopolymers, Japan
发表日期
2015-08-19
DOI
10.2494/photopolymer.28.169

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