Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 24, Issue 4, Pages 810-821Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2014.2349894
Keywords
Sensor systems; MEMS; sensor fusion; microsystems; Internet of things
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Funding
- Hewlett-Packard Labs Innovation Research Program
- National Science Foundation (NSF) Center of Integrated Nanosystems [ECCS-083281]
- Stanford Energy and Environment Affiliates Program through Chevron Corporation, San Ramon, CA, USA
- Defense Advanced Research Projects Agency [N66001-12-1-4260]
- Sandia National Labs Excellence in Engineering Fellowship
- NSF within the National Nanotechnology Infrastructure Network through Center for Integrated Systems, Stanford University, Stanford, CA, USA [ECS-9731293]
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [1542152] Funding Source: National Science Foundation
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We present multifunctional integrated sensors (MFISES) that combine temperature, humidity, pressure, air speed, chemical gas, magnetic, and acceleration sensing on a single 2-mm x 2-mm die. We fabricate the MFISES in a wafer scale encapsulation process to hermetically seal the sensor functions with moving parts at low vacuum, and then surface micromachine the environmental sensors on top of the sealed layer. The encapsulation process provides very stable conditions for the pressure, magnetic, and acceleration sensors, and enables the deployment of the MFISES in dynamic environmental conditions without special postprocess packaging. We quantify the performance requirements for sensor applications in weather stations, indoor climate control, road activity monitoring, chemical sensing, and parking monitoring. We compare the performance of the MFISES to the application requirements to demonstrate the utility of an integrated sensor in a wide range of applications.
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