Effect of Ag on the properties of solders and brazing filler metals

A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys

(2014) Cillian Burke et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

(2012) Rizk Mostafa Shalaby   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

(2012) Dhafer Abdul Ameer Shnawah et al.   MICROELECTRONICS INTERNATIONAL

Microstructure and properties of Cu/Al joints brazed with Zn–Al filler metals

(2012) Feng JI et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Dissolution behavior of Cu in Cu-Ag and Cu-P brazing alloys using weld brazing

(2011) Yi-nan LI et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Effect of Ag Addition on the Ripening Growth of ${\rm Cu}_{6}{\rm Sn}_{5}$ Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

(2011) Moon Gi Cho et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

(2010) Liang Zhang et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Substrate oxide undermining by a Zn–Al alloy during wetting of alumina reinforced 6061 Al matrix composite

(2008) Zhiwu Xu et al.   MATERIALS CHEMISTRY AND PHYSICS

Effects of dynamic electropulsing on microstructure and elongation of a Zn–Al alloy

(2008) Y.H. Zhu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of Ag content on the microstructure of Sn‐Ag‐Cu based solder alloys

(2008) M. Reid et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Effects of silver doping on electromigration of eutectic SnBi solder

(2007) Chih-ming Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of silver addition on the creep parameters of Sn–7 wt.% Bi alloy during transformation

(2006) F. Abd El-Salam et al.   MATERIALS CHARACTERIZATION