Effect of pulsed voltage on electrochemical migration of tin in electronics

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

(2014) Vadimas Verdingovas et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Electrochemical Migration Behavior of a Fine-Pitch IC Substrate by Alternating Current

(2014) JongSoo Kim et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Dynamics of Lithium Dendrite Growth and Inhibition: Pulse Charging Experiments and Monte Carlo Calculations

(2014) Asghar Aryanfar et al.   Journal of Physical Chemistry Letters

Effects of Pulse Plating on lithium electrodeposition, morphology and cycling efficiency

(2014) Heng Yang et al.   JOURNAL OF POWER SOURCES

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

(2013) V. Verdingovas et al.   CORROSION ENGINEERING SCIENCE AND TECHNOLOGY

Electrochemical migration of tin in thin electrolyte layer containing chloride ions

(2013) Xiankang Zhong et al.   CORROSION SCIENCE

Reliability Analysis and Accelerated Statistical Model of CNC PCB for Electrochemical Migration

(2013) Chuanning Xie et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field

(2013) Xiankang Zhong et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Detection of subsurface structures underneath dendrites formed on cycled lithium metal electrodes

(2013) Katherine J. Harry et al.   NATURE MATERIALS

In situ study the dependence of electrochemical migration of tin on chloride

(2012) Xiankang Zhong et al.   ELECTROCHEMISTRY COMMUNICATIONS

Improvement of Electrochemical Migration Resistance by Cu/Sn Intermetallic Compound Barrier on Cu in Printed Circuit Board

(2012) Min-Suk Jung et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Suppression of Dendrite Formation via Pulse Charging in Rechargeable Lithium Metal Batteries

(2012) Matthew Z. Mayers et al.   Journal of Physical Chemistry C

On the electrochemical migration mechanism of tin in electronics

(2011) Daniel Minzari et al.   CORROSION SCIENCE

Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder

(2011) Xiaofei He et al.   JOURNAL OF ELECTRONIC MATERIALS

Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37

(2011) Bálint Medgyes et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

(2009) D. Minzari et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb

(2009) Shin-Bok Lee et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

(2009) Bo-In Noh et al.   JOURNAL OF ELECTRONIC MATERIALS

Reliability of Printed Circuit Boards Processed Using No-Clean Flux Technology in Temperature–Humidity–Bias Conditions

(2008) Sheng Zhan et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Characterization of the Conduction Mechanisms in Adsorbed Electrolyte Layers on Electronic Boards Using AC Impedance

(2008) Ling Chunxian Zou et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of surface finish material on printed circuit board for electrochemical migration

(2007) Bo-In Noh et al.   MICROELECTRONICS RELIABILITY