In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field

Electrochemical migration of tin in thin electrolyte layer containing chloride ions

(2013) Xiankang Zhong et al.   CORROSION SCIENCE

The corrosion of tin under thin electrolyte layers containing chloride

(2012) Xiankang Zhong et al.   CORROSION SCIENCE

In situ study the dependence of electrochemical migration of tin on chloride

(2012) Xiankang Zhong et al.   ELECTROCHEMISTRY COMMUNICATIONS

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

(2012) Bo-In Noh et al.   MICROELECTRONIC ENGINEERING

On the electrochemical migration mechanism of tin in electronics

(2011) Daniel Minzari et al.   CORROSION SCIENCE

Electrochemical migration of tin in electronics and microstructure of the dendrites

(2011) Daniel Minzari et al.   CORROSION SCIENCE

Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37

(2011) Bálint Medgyes et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electrochemical synthesis of compositionally modulated FexPd1−x nanowires

(2010) Byungjun Jeon et al.   ELECTROCHIMICA ACTA

Corrosion failure due to flux residues in an electronic add-on device

(2010) Morten S. Jellesen et al.   ENGINEERING FAILURE ANALYSIS

In situ optical inspection of electrochemical migration during THB tests

(2010) Bálint Medgyes et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders

(2010) Y. R. Yoo et al.   METALS AND MATERIALS INTERNATIONAL

Effect of electrodeposition parameters on the hydrogen permeation during Cu–Sn alloy electrodeposition

(2009) Guozhe Meng et al.   ELECTROCHIMICA ACTA

Localized electrochemical deposition of micrometer copper columns by pulse plating

(2009) J.C. Lin et al.   ELECTROCHIMICA ACTA

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

(2009) D. Minzari et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb

(2009) Shin-Bok Lee et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

(2009) Bo-In Noh et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

(2008) Ja-Young Jung et al.   JOURNAL OF ELECTRONIC MATERIALS