Advanced surface protection for improved reliability PCB systems (ASPIS)

Room-Temperature Ionic Liquids: Solvents for Synthesis and Catalysis. 2

(2011) Jason P. Hallett et al.   CHEMICAL REVIEWS

Identification and prevention of “Black Pad” in Sn/Pb soldering

(2011) Kong Hui Lee   CIRCUIT WORLD

Double layer effects on metal nucleation in deep eutectic solvents

(2011) Andrew P. Abbott et al.   PHYSICAL CHEMISTRY CHEMICAL PHYSICS

The pH effect on black spots in surface finish: Electroless nickel immersion gold

(2010) Yong Sun Won et al.   APPLIED SURFACE SCIENCE

Is “black pad” still an issue for ENIG?

(2010) George Milad   CIRCUIT WORLD

A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process

(2010) K.H. Kim et al.   SCRIPTA MATERIALIA

The root causes of the “Black pad” phenomenon and avoidance tactics

(2008) Katsuaki Suganuma et al.   JOM

Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process

(2008) Bae-Kyun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

The corrosion resistance of electroless deposited nano-crystalline Ni–P alloys

(2007) Maura Crobu et al.   ELECTROCHIMICA ACTA

Sustained electroless deposition of metallic silver from a choline chloride-based ionic liquid

(2007) Andrew P. Abbott et al.   SURFACE & COATINGS TECHNOLOGY

Effect of organic additives on the corrosion resistance properties of electroless nickel deposits

(2007) Hai-Ping Liu et al.   THIN SOLID FILMS