Embedding and assembly of ultrathin chips in multilayer flex boards

Published 2008 View Full Article

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Title
Embedding and assembly of ultrathin chips in multilayer flex boards
Authors
Keywords
-
Journal
CIRCUIT WORLD
Volume 34, Issue 3, Pages 3-8
Publisher
Emerald
Online
2008-09-06
DOI
10.1108/03056120810896209

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