Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Published 2015 View Full Article

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Title
Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 137, Issue 3, Pages 031004
Publisher
ASME International
Online
2015-04-04
DOI
10.1115/1.4030286

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