Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map

Published 2011 View Full Article

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Title
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 41, Issue 2, Pages 412-424
Publisher
Springer Nature
Online
2011-11-17
DOI
10.1007/s11664-011-1806-7
References
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