Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints

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标题

作者

关键词

Lead-free solder, Ga alloying, Melting points, Interfacial reaction, Shear strength, Fatigue property

出版物

JOURNAL OF ALLOYS AND COMPOUNDS

Volume 622, Issue -, Pages 973-978

出版商

Elsevier BV

发表日期

2014-11-17

DOI

10.1016/j.jallcom.2014.11.030

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