Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing

Title
Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing
Authors
Keywords
-
Journal
APPLIED THERMAL ENGINEERING
Volume 64, Issue 1-2, Pages 76-82
Publisher
Elsevier BV
Online
2013-12-17
DOI
10.1016/j.applthermaleng.2013.12.007

Ask authors/readers for more resources

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started