Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing

出版年份 2013 全文链接

标题

Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing

作者

关键词

-

出版物

APPLIED THERMAL ENGINEERING

Volume 64, Issue 1-2, Pages 76-82

出版商

Elsevier BV

发表日期

2013-12-17

DOI

10.1016/j.applthermaleng.2013.12.007

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Protocol

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