Thermal conductivity enhancement with different fillers for epoxy resin adhesives

标题
Thermal conductivity enhancement with different fillers for epoxy resin adhesives
作者
关键词
-
出版物
APPLIED THERMAL ENGINEERING
Volume 66, Issue 1-2, Pages 493-498
出版商
Elsevier BV
发表日期
2014-02-28
DOI
10.1016/j.applthermaleng.2014.02.044

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