Extreme wettability due to dendritic copper nanostructure via electrodeposition

Published 2011 View Full Article

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Title
Extreme wettability due to dendritic copper nanostructure via electrodeposition
Authors
Keywords
-
Journal
APPLIED SURFACE SCIENCE
Volume 257, Issue 20, Pages 8438-8442
Publisher
Elsevier BV
Online
2011-05-08
DOI
10.1016/j.apsusc.2011.04.126

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