Extreme wettability due to dendritic copper nanostructure via electrodeposition

Dendritic copper film with convertible extreme wettability is prepared on metal surface via electrodeposition. With field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD) and electrochemical measurement, the morphology, composition and formation mechanism of dendritic copper film were studied. It is found that the film is mainly composed of metallic copper. Also some residual cuprous oxide and chloride exist in the deposit. The single micron-sized dendrite consists of a main stem with side branches, on which the higher-order branches with the dimension of tens of nanometers grow. A hydrophobic modification can induce the conversion of the apparent wettability of film from super-hydrophilicity (with apparent water contact angle of 5 +/- 3 degrees) to super-hydrophobicity (with apparent water contact angle of 154.1 +/- 3 degrees), which is due to the capillary effect. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with a high wettability contrast for water. (C) 2011 Elsevier B. V. All rights reserved.