Use of a PECVD–PVD process for the deposition of copper containing organosilicon thin films on steel

Published 2009 View Full Article

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Title
Use of a PECVD–PVD process for the deposition of copper containing organosilicon thin films on steel
Authors
Keywords
-
Journal
APPLIED SURFACE SCIENCE
Volume 256, Issue 3, Pages S82-S85
Publisher
Elsevier BV
Online
2009-05-08
DOI
10.1016/j.apsusc.2009.04.195

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