Use of a PECVD–PVD process for the deposition of copper containing organosilicon thin films on steel

标题
Use of a PECVD–PVD process for the deposition of copper containing organosilicon thin films on steel
作者
关键词
-
出版物
APPLIED SURFACE SCIENCE
Volume 256, Issue 3, Pages S82-S85
出版商
Elsevier BV
发表日期
2009-05-08
DOI
10.1016/j.apsusc.2009.04.195

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