Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management

Title
Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management
Authors
Keywords
-
Journal
APPLIED PHYSICS LETTERS
Volume 102, Issue 1, Pages 014101
Publisher
AIP Publishing
Online
2013-01-05
DOI
10.1063/1.4772800

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