Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management
出版年份 2013 全文链接
标题
Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management
作者
关键词
-
出版物
APPLIED PHYSICS LETTERS
Volume 102, Issue 1, Pages 014101
出版商
AIP Publishing
发表日期
2013-01-05
DOI
10.1063/1.4772800
参考文献
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