Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

标题
Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
作者
关键词
-
出版物
APPLIED PHYSICS LETTERS
Volume 94, Issue 18, Pages 181914
出版商
AIP Publishing
发表日期
2009-05-09
DOI
10.1063/1.3133345

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