Molecular dynamics simulation of thermal conductivity of Cu–Ar nanofluid using EAM potential for Cu–Cu interactions

Title
Molecular dynamics simulation of thermal conductivity of Cu–Ar nanofluid using EAM potential for Cu–Cu interactions
Authors
Keywords
-
Journal
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 103, Issue 4, Pages 1001-1008
Publisher
Springer Nature
Online
2011-04-05
DOI
10.1007/s00339-011-6379-z

Ask authors/readers for more resources

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now