On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

Published 2018 View Full Article

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Title
On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 160, Issue -, Pages 185-198
Publisher
Elsevier BV
Online
2018-09-01
DOI
10.1016/j.actamat.2018.08.049

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