Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper

标题
Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper
作者
关键词
-
出版物
ACTA MATERIALIA
Volume 56, Issue 5, Pages 1075-1083
出版商
Elsevier BV
发表日期
2008-01-22
DOI
10.1016/j.actamat.2007.11.009

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