Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Electroless copper plating on nano-silver activated glass substrate: A single-step activation

(2017) Attaphon Kaewvilai et al.   SURFACE & COATINGS TECHNOLOGY

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

(2017) Wanli Li et al.   Journal of Materials Chemistry C

3D-Printed Autonomous Sensory Composites

(2017) Subramanian Sundaram et al.   Advanced Materials Technologies

Hydroprinting Conductive Patterns onto 3D Structures

(2017) Gabriel Saada et al.   Advanced Materials Technologies

Paper-Based Inkjet-Printed Flexible Electronic Circuits

(2016) Yan Wang et al.   ACS Applied Materials & Interfaces

3D Printing: 3D Printing of Shape Memory Polymers for Flexible Electronic Devices (Adv. Mater. 22/2016)

(2016) Matt Zarek et al.   ADVANCED MATERIALS

A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics

(2016) Yan Wang et al.   ELECTROCHIMICA ACTA

Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

(2016) Jin-ju Chen et al.   Journal of Materials Chemistry C

A particle-free silver precursor ink useful for inkjet printing to fabricate highly conductive patterns

(2016) Jin-ju Chen et al.   Journal of Materials Chemistry C

Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

(2016) Wanli Li et al.   Journal of Materials Chemistry C

Additive and Photochemical Manufacturing of Copper

(2016) Winco K. C. Yung et al.   Scientific Reports

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

(2015) Yousef Farraj et al.   CHEMICAL COMMUNICATIONS

3D-printed spherical dipole antenna integrated on small RF node

(2015) J.J. Adams et al.   ELECTRONICS LETTERS

Three-dimensional printed electronics

(2015) Jennifer A. Lewis et al.   NATURE

3D printing of porous structures by UV-curable O/W emulsion for fabrication of conductive objects

(2015) I. Cooperstein et al.   Journal of Materials Chemistry C

Electroless Copper Plating of Inkjet-Printed Polydopamine Nanoparticles: a Facile Method to Fabricate Highly Conductive Patterns at Near Room Temperature

(2014) Siyuan Ma et al.   ACS Applied Materials & Interfaces

Fabrication of Copper Patterns on Flexible Substrate by Patterning–Adsorption–Plating Process

(2014) Yu Chang et al.   ACS Applied Materials & Interfaces

A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics

(2014) Dong-Hun Shin et al.   ACS Applied Materials & Interfaces

Nanoinks in inkjet metallization — Evolution of simple additive-type metal patterning

(2014) Henry J. Gysling   CURRENT OPINION IN COLLOID & INTERFACE SCIENCE

Laser curing of silver-based conductive inks for in situ 3D structural electronics fabrication in stereolithography

(2014) Amit J. Lopes et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating

(2014) Dmitrii I. Petukhov et al.   MATERIALS LETTERS

Inkjet printing of a pH sensitive palladium catalyst patterns of ITO glass for electroless copper

(2014) Min-Wen Wang et al.   SURFACE & COATINGS TECHNOLOGY

Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

(2014) Yitzchak Rosen et al.   Advanced Materials Interfaces

Initiator-Integrated 3D Printing Enables the Formation of Complex Metallic Architectures

(2013) Xiaolong Wang et al.   ACS Applied Materials & Interfaces

Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

(2013) Benjamin S. Cook et al.   Electronic Materials Letters

Direct Writing Patterns for Electroless Plated Copper Thin Film on Plastic Substrates

(2012) Ying-Chih Liao et al.   ACS Applied Materials & Interfaces

Stretchable Conductors with Ultrahigh Tensile Strain and Stable Metallic Conductance Enabled by Prestrained Polyelectrolyte Nanoplatforms

(2011) Xiaolong Wang et al.   ADVANCED MATERIALS

Conformal Printing of Electrically Small Antennas on Three-Dimensional Surfaces

(2011) Jacob J. Adams et al.   ADVANCED MATERIALS

Universal robotic gripper based on the jamming of granular material

(2010) E. Brown et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

A biomimetic jellyfish robot based on ionic polymer metal composite actuators

(2009) Sung-Weon Yeom et al.   Smart Materials and Structures