Effects of anions on the underpotential deposition behavior of Cu on polycrystalline Pt

Potentiodynamic Electrochemical Impedance Spectroscopy for Underpotential Deposition Processes

(2015) G. A. Ragoisha   ELECTROANALYSIS

Study of Tin Electroplating Process Using Electrochemical Impedance and Noise Techniques

(2013) Xianqiu Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Kinetics of hydrogen underpotential deposition at polycrystalline platinum in acidic solutions

(2012) Bożena Łosiewicz et al.   ELECTROCHIMICA ACTA

Probing the Halide–Metal Interaction by Monolayer Metal Deposition at the Electrochemical Interface

(2012) Yvonne Gründer et al.   Journal of Physical Chemistry C

In depth analysis of complex interfacial processes: in situ electrochemical characterization of deposition of atomic layers of Cu, Pb and Te on Pd electrodes

(2012) Minghua Huang et al.   RSC Advances

Influence of the substrate's surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold

(2011) M. Palomar-Pardavé et al.   ELECTROCHIMICA ACTA

Simultaneous Acquisition of Impedance and Gravimetric Data in a Cyclic Potential Scan for the Characterization of Nonstationary Electrode/Electrolyte Interfaces

(2011) Balázs B. Berkes et al.   Journal of Physical Chemistry C

Real-Time Staircase Cyclic Voltammetry Fourier Transform Electrochemical Impedance Spectroscopic Studies on Underpotential Deposition of Lead on Gold

(2008) Byoung-Yong Chang et al.   Journal of Physical Chemistry C

Initial stages of copper electrocrystallization on polycrystalline platinum and glassy carbon in the presence of acetonitrile

(2008) A. V. Rudnev et al.   RUSSIAN JOURNAL OF ELECTROCHEMISTRY