Thermal Analysis of High-Power Multichip COB Light-Emitting Diodes With Different Chip Sizes

Title
Thermal Analysis of High-Power Multichip COB Light-Emitting Diodes With Different Chip Sizes
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 62, Issue 3, Pages 896-901
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2015-02-10
DOI
10.1109/ted.2015.2390255

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