Thermal Analysis of High-Power Multichip COB Light-Emitting Diodes With Different Chip Sizes

出版年份 2015 全文链接

标题

作者

关键词

出版物

Volume 62, Issue 3, Pages 896-901

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2015-02-10

DOI

10.1109/ted.2015.2390255

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