Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding

Published 2015 View Full Article

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Title
Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding
Authors
Keywords
-
Journal
IEEE ELECTRON DEVICE LETTERS
Volume 36, Issue 7, Pages 702-704
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2015-05-16
DOI
10.1109/led.2015.2434053

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