Influence of microstructure on thermal stability of ultrafine-grained Cu processed by equal channel angular pressing

Effect of grain structure on Charpy impact behavior of copper

(2017) Ningning Liang et al.   Scientific Reports

High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding

(2016) L.F. Zeng et al.   ACTA MATERIALIA

The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion

(2016) Yi Huang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Stabilization of nanocrystalline alloys via grain boundary segregation: A diffuse interface model

(2015) Fadi Abdeljawad et al.   ACTA MATERIALIA

In situ observation of triple junction motion during recovery of heavily deformed aluminum

(2015) Tianbo Yu et al.   ACTA MATERIALIA

Thermal behavior of copper processed by ECAP with and without back pressure

(2015) Ya Li Wang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Thermal stability of nanocrystalline nickel with yttrium additions

(2013) K.A. Darling et al.   JOURNAL OF MATERIALS RESEARCH

The thermal stability of high-energy ball-milled nanostructured Cu

(2013) J.M. Tao et al.   MATERIALS & DESIGN

Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion

(2013) O.F. Higuera-Cobos et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Annealing behaviour of ultrafine-grained aluminium

(2013) Pei-Ling Sun et al.   PHILOSOPHICAL MAGAZINE

Strain-Induced Ultrahard and Ultrastable Nanolaminated Structure in Nickel

(2013) X. C. Liu et al.   SCIENCE

The stabilization of nanocrystalline copper by zirconium

(2012) Mark A. Atwater et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Evolution of recrystallization texture in a 0.78wt.% Cr extra-low-carbon steel after warm and cold rolling

(2011) Azdiar A. Gazder et al.   ACTA MATERIALIA

Strength and Ductility of Bi-Modal Cu

(2011) Yonghao Zhao et al.   ADVANCED ENGINEERING MATERIALS

Recovery by triple junction motion in aluminium deformed to ultrahigh strains

(2011) T. Yu et al.   PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES

Strategies for Improving Tensile Ductility of Bulk Nanostructured Materials

(2010) Yonghao Zhao et al.   ADVANCED ENGINEERING MATERIALS

Thermal stability of nanocrystalline Fe–Zr alloys

(2010) K.A. Darling et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures

(2009) W. Blum et al.   ACTA MATERIALIA

Work softening and annealing hardening of deformed nanocrystalline nickel

(2009) X. Y. Zhang et al.   APPLIED PHYSICS LETTERS

Stabilizing nanostructured materials by coherent nanotwins and their grain boundary triple junction drag

(2009) C. Saldana et al.   APPLIED PHYSICS LETTERS

Response of aluminum processed by extrusion preceded ECAP to isochronal annealing

(2009) Aikaterini Zi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Grain boundary diffusion and recrystallization in ultrafine grain copper produced by equal channel angular pressing

(2008) Y. Amouyal et al.   ACTA MATERIALIA

Unraveling the nature of room temperature grain growth in nanocrystalline materials

(2008) Markus Ames et al.   ACTA MATERIALIA

Nonlinear optical absorption and reflection of single wall carbon nanotube thin films by Z-scan technique

(2008) Daisuke Shimamoto et al.   APPLIED PHYSICS LETTERS

Stored energy and recrystallization temperature in high purity copper after equal channel angular pressing

(2008) Yue Zhang et al.   JOURNAL OF MATERIALS SCIENCE

Stabilization of nanocrystalline grain sizes by solute additions

(2008) C. C. Koch et al.   JOURNAL OF MATERIALS SCIENCE

Stored energy, vacancies and thermal stability of ultra-fine grained copper

(2008) W.Q. Cao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING