Thermal behavior of copper processed by ECAP with and without back pressure

Published 2015 View Full Article

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Title
Thermal behavior of copper processed by ECAP with and without back pressure
Authors
Keywords
Thermal stability, Equal Channel Angular Pressing (ECAP), Back pressure, Copper, Recrystallization
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 628, Issue -, Pages 21-29
Publisher
Elsevier BV
Online
2015-01-16
DOI
10.1016/j.msea.2015.01.021

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