Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

标题
Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 732, Issue -, Pages 240-247
出版商
Elsevier BV
发表日期
2017-11-03
DOI
10.1016/j.jallcom.2017.10.193

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started