Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs

Title
Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 123, Issue -, Pages 272-284
Publisher
Elsevier BV
Online
2018-03-20
DOI
10.1016/j.ijheatmasstransfer.2018.02.044

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