Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs

出版年份 2018 全文链接

标题

作者

关键词

出版物

Volume 123, Issue -, Pages 272-284

出版商

Elsevier BV

发表日期

2018-03-20

DOI

10.1016/j.ijheatmasstransfer.2018.02.044

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