Impact of pad conditioning on the bonnet polishing process

The effect of tool wear on the removal characteristics in high-efficiency bonnet polishing

(2017) Zhong Bo et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

An experimental study on the correlation of polishing force and material removal for bonnet polishing of cobalt chrome alloy

(2014) S. Zeng et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

An investigation of the viability of bonnet polishing as a possible method to manufacture hip prostheses with multi-radius femoral heads

(2013) S. Zeng et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Experimental investigation and analytical modelling of the effects of process parameters on material removal rate for bonnet polishing of cobalt chrome alloy

(2013) Shengyue Zeng et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations

(2012) Eun-Sang Lee et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Prediction of Real Contact Area from Microtopography on CMP Pad

(2012) Hobin JEONG et al.   Journal of Advanced Mechanical Design Systems and Manufacturing

Finishing of optical moulds to λ /20 by automated corrective polishing

(2011) A. Beaucamp et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape

(2011) Z.C. Li et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes

(2010) Ji Chul Yang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Pseudo-random tool paths for CNC sub-aperture polishing and other applications

(2008) Christina R. Dunn et al.   OPTICS EXPRESS

Correlation between break-in characteristics and pad surface conditions in silicon wafer polishing

(2007) Kihyun Park et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY