Article
Engineering, Electrical & Electronic
Haozhe Jin, Wu Chen, Yeyuan Xie, Liangcai Shu, Yutao Xu
Summary: This article proposes an optimized asymmetric trapezoidal wave (ATW) modulation scheme for a modular multilevel resonant dc/dc converter (MMRDC) to reduce current stress over wide load and voltage ranges. The optimized operating point of MMRDC is derived based on the soft switching characteristic and reactive current analysis, considering low current stress and zero voltage switching constraint. The experimental results on a 4 kW MMRDC prototype verify the correctness and effectiveness of the analysis and the optimized ATW modulation scheme.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Govind Avinash Reddy, Anshuman Shukla
Summary: In this article, a new enhanced modular multilevel converter (EMMC) is introduced, which addresses the drawbacks of the conventional modular multilevel converters (MMC). The EMMC, based on a new submodule (SM) structure, is fully modular and requires fewer switches and capacitors. It possesses the features of reduced energy-storage requirement and dc fault-tolerant capability.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Automation & Control Systems
Tianxiang Yin, Lei Lin, Chen Xu, Donghai Zhu, Kaiyuan Jing
Summary: This article proposes a hybrid modular multilevel converter (MMC) topology based on SiC mosfet and Si IGBT. By improving the modulation scheme and introducing a specialized voltage balancing scheme, the performance of the system is enhanced. Simulation and experimental results demonstrate the feasibility of the hybrid MMC and its superiority in terms of cost, loss, and feasibility compared to others.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Zhijie Liu, Ke-Jun Li, Zhonglin Guo, Jinyu Wang, Jianhang Qian
Summary: This article focuses on evaluating the over-modulation risk of modular multilevel converters (MMCs). It proposes a new concept called dynamic modulation ratio (DMR) to accurately reflect the modulation characteristics, as the conventional modulation ratio (CMR) is found to be inaccurate for MMCs. Quantitative comparisons show that the DMR-based evaluation method is consistently accurate in all situations.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Futian Qin, Feng Gao, Yi Tang, Tao Xu, Jinyu Wang, Decun Niu
Summary: This article introduces a new nine-arm modular multilevel converter with improved hybrid submodules for middle arms, which can reduce the dc-side voltage, eliminate the dc offset in common mode voltages, and provides a control method for middle arm current. The feasibility and performance characteristics of the proposed 9A-MMC were verified through simulation and experimental results.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2021)
Article
Engineering, Electrical & Electronic
Jinliang Huang, Kaijie Li, Yuanmao Ye, Xiaolin Wang
Summary: A new clamp-double-SM (CDSM) based MMC topology is proposed in this article, which achieves self-balanced outputs and reduces the use of complex balancing algorithms. By adding auxiliary balance branches, capacitor voltages among different SMs are also self-balanced, reducing the number of components and costs.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2022)
Article
Automation & Control Systems
Saleh Farzamkia, Houshang Salimian Rizi, Alex Q. Huang, Hossein Iman-Eini
Summary: This article proposes a shared redundancy strategy for improving the reliability and useful lifetime of the modular multilevel converter (MMC) by allowing the flexible utilization of redundant submodules (RSMs) in both upper and lower arms. Simulation and experimental results confirm the effectiveness of this strategy in enhancing the reliability and fault-tolerant capability of MMC.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2023)
Article
Automation & Control Systems
Hongqi Ding, Fujun Ma, Rong Han, Lei Wang, Man-Chung Wong
Summary: This article proposes a control method to achieve thermal distribution balance between top and bottom devices, successfully reducing temperature differences and increasing system lifetime.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2023)
Article
Automation & Control Systems
Mohammadali Ahmadijokani, Majid Mehrasa, Mohammad Sleiman, Mohammad Sharifzadeh, Abdolreza Sheikholeslami, Kamal Al-Haddad
Summary: The article introduces a back-stepping method (BSM) in a-b-c reference for establishing stable operating conditions for modular multilevel converters (MMC). The BSM reduces control variable errors in the MMC system and has a feature of circulating current suppression control loops, eliminating the need for additional control loops.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2021)
Article
Automation & Control Systems
Yue Zhang, Fujin Deng, Jiehua Hou, Pengyuan Jiang, Hanlu Zhang, Kangshun Zhu, Yihua Hu, Sergio Vazquez
Summary: This article proposes a cascaded MMC and CCV based drive system to overcome the challenge of large capacitor voltage fluctuation in low-speed drive. The MMC provides medium-frequency AC voltage to the CCV, which converts it into low-frequency AC output required by the machine. Detailed analysis of MMC's operation frequency, device current stress, and SM capacitance are presented. The proposed drive system can operate at zero/low frequency under rated load torque, with smaller SM capacitance compared to existing methods. Simulation and experimental studies confirm the effectiveness of the proposed system.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2023)
Article
Automation & Control Systems
Zhen Wang, Li Peng
Summary: An arm current reshaping-based method is proposed in this article to suppress the capacitor overvoltage under submodule open-circuit fault in modular multilevel converters (MMCs). By reshaping the arm currents and injecting common-mode voltage, the degree of submodule overvoltage can be alleviated effectively.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2022)
Article
Engineering, Multidisciplinary
Mai Diab, Ahmed A. Elserougi, A. S. Abdel-Khalik
Summary: This paper presents a hybrid modular multilevel DC-DC converter topology that successfully solves the issue of capacitors voltage imbalance during DC-DC conversion. The proposed converter can achieve arm energy equalization and operate as a DC transformer.
ALEXANDRIA ENGINEERING JOURNAL
(2023)
Article
Engineering, Electrical & Electronic
Luis Camurca, Thiago Pereira, Felix Hoffmann, Marco Liserre
Summary: This article discusses the application of the modular multilevel converter (MMC) as an active front-end rectifier in FCS infrastructures, and analyzes its advantages and limitations as a step-down rectifier. Different architectures are studied and evaluated in terms of key performance indicators such as size, efficiency, and reliability. The experimental results validate the analysis presented in this article.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Hua Mao, Huaping Jiang, Li Ran, Jiayu Hu, Guanqun Qiu, Jingfeng Wei, Haoyu Chen, Xiaohan Zhong, Nianlei Xiao, Liwei Wang, Minxiang Yang
Summary: This article proposes an asymmetrical power module design for improving the reliability of the SMs in MMCs by considering the loading profile. Simulation and experiment results demonstrate that the designed power module can reduce the maximum temperature, decrease total power loss by 5%-8%, and improve chip utilization rate. The proposed module is applicable within a certain range of power factor and modulation index adjustment.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Mengfan Zhang, Yang Zhang, Qianwen Xu
Summary: This study proposes a transfer learning-based online impedance identification method to address stability analysis issues in modular multilevel converters (MMC). By utilizing the physical model in the offline phase, the proposed method significantly reduces the data requirement and achieves online stability analysis.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)