4.4 Article Proceedings Paper

Atomistic Tight-Binding Study of Contact Resistivity in Si/SiGe PMOS Schottky Contacts

Journal

IEEE TRANSACTIONS ON NANOTECHNOLOGY
Volume 17, Issue 5, Pages 968-973

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TNANO.2018.2840836

Keywords

Contact resistivity; PMOS; quantum transport; tight binding

Funding

  1. Intel Corporation
  2. Accelerating Nanoscale Transistor Innovation
  3. NEMO5 on Blue Waters PRAC allocation by the National Science Foundation [OCI-0832623]
  4. Semiconductor Research Corporations Global Research Collaboration (GRC) [2653.001]

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The metal-semiconductor contact resistivity has started to play a critical role for the overall device performance as Si is reaching 10-nm size ranges. The International Technology Roadmap for Semiconductors (ITRS) target predicts a requirement of 10(-9) Omega.cm(2) by 2023 which has been a challenging target to achieve. This paper explores the impact of doping concentration, Schottky barrier height, strain, and SiGemole fraction on the resistivity of Si/SiGe p-type metal-oxide semiconductor (PMOS) contacts with 20-band atomistic tight binding quantum transport simulations. Commonly used simple effective mass approximation models are shown to overestimate the resistivity values. The predicted model results are compared with experimental data and the device parameters needed to achieve 10(-9) Omega.cm(2) are identified.

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