Flexible IGZO TFT SPICE model and design of active strain-compensation circuits for bendable active matrix arrays

Published 2018 View Full Article

Authors

Keywords

Journal

IEEE ELECTRON DEVICE LETTERS

Volume -, Issue -, Pages 1-1

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Online

2018-07-10

DOI

10.1109/led.2018.2854541

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IEEE ELECTRON DEVICE LETTERS

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