A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer

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Title
A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer
Authors
Keywords
Cu immersion, Deep eutectic solvent, Accelerator, Electroless Ni-P, Medium-low temperature
Journal
SURFACE & COATINGS TECHNOLOGY
Volume 309, Issue -, Pages 67-74
Publisher
Elsevier BV
Online
2016-11-18
DOI
10.1016/j.surfcoat.2016.11.029

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