Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology
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Title
Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology
Authors
Keywords
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Journal
Nanoscale
Volume 9, Issue 34, Pages 12524-12532
Publisher
Royal Society of Chemistry (RSC)
Online
2017-07-27
DOI
10.1039/c7nr03803h
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