Surface pretreated low-temperature aluminum–aluminum wafer bonding

Published 2017 View Full Article

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Title
Surface pretreated low-temperature aluminum–aluminum wafer bonding
Authors
Keywords
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Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 24, Issue 1, Pages 773-777
Publisher
Springer Nature
Online
2017-08-19
DOI
10.1007/s00542-017-3520-8
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