Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

Authors

Keywords

Lead-free solder joint, Corrosion, Microstructure, Solidification cracks

Journal

MICROELECTRONICS RELIABILITY

Volume 73, Issue -, Pages 69-75

Publisher

Elsevier BV

Online

2017-04-21

DOI

10.1016/j.microrel.2017.04.017

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