Journal
MATERIALS LETTERS
Volume 197, Issue -, Pages 52-55Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2017.03.158
Keywords
Amorphous materials; Deposition; Thin films
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In this paper, we demonstrate the applicability of ultra-smooth e-beam evaporated amorphous silicon thin films (<500 nm) as an alternative for PECVD thin films in MEMS applications. In this regard, a thorough investigation of the material and structural characteristics of low-temperature e-beam evaporated amorphous silicon thin films is carried out and it reveals that these properties are very similar to that of PECVD silicon thin films. E-beam evaporated amorphous silicon offers an ultra-smooth surface, which helps in realizing MEMS devices with close to ideal frequency response. The suitability of these thin films for MEMS applications is demonstrated by fabricating micro-cantilevers using the optimized thin film deposition conditions. (C) 2017 Elsevier B.V. All rights reserved.
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