Article
Materials Science, Multidisciplinary
Xiao Lu, Liang Zhang, Chen Chen, Xi Wang
Summary: This study showed that doping Si3N4 nanowires into SAC105 solder improved its thermal and mechanical properties, as well as optimized its CTE matching and grain orientation.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Materials Science, Multidisciplinary
Yuanyuan Qiao, Hongwei Liang, Ning Zhao
Summary: The orientation transformation of Cu6Sn5 grains in Cu/Sn-xAg/Cu micro solder joints under temperature gradient was investigated, and it was found that the transformation significantly depended on the Ag content. The results provide guidelines for improving the reliability of micro joints for 3D packaging or high temperature applications by discussing the combined effect of Ag solid solution and Ag3Sn absorbates on the orientation transformation.
JOURNAL OF MATERIALS SCIENCE
(2023)
Article
Engineering, Electrical & Electronic
El Mostafa Barik, Charlotte Gillot, Fiqiri Hodaj
Summary: With the continuous advancement of technology, challenges in power density are increasing, requiring the use of new techniques to improve the thermal stability of systems. Transient liquid phase bonding and solid-state reactions are currently the most studied techniques in response to these challenges.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Engineering, Electrical & Electronic
Ziwen Lv, Jintao Wang, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Chunjin Hang, Hongtao Chen
Summary: In this study, Cu6Sn5 nanoparticles were added to SAC305 solder paste to improve its mechanical strength and service reliability. The addition of Cu6Sn5 NPs enhanced the solderability and shear strength of the composite solder paste, leading to improved reliability in harsh operating environments.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Materials Science, Multidisciplinary
Hung-Che Liu, A. M. Gusak, K. N. Tu, Chih Chen
Summary: This study utilized Cu-to-Cu direct bonding technology and transmission electron microscopy to investigate the size distribution and evolution of voids under different conditions. The interface ripening effect was observed, with void size and count increasing with annealing time. A simple kinetic model of ripening was developed, showing good agreement with experimental data.
MATERIALS CHARACTERIZATION
(2021)
Article
Materials Science, Multidisciplinary
Jianwu Yu, Liang Huang, Jingchao Wang, Zhongxun Hu, Yang Hai
Summary: In this study, the interfacial properties between Cu-Sn alloys and diamond surfaces were investigated using density-functional theory (DFT). The results showed that Cu6Sn5 is a crucial compound in determining the interfacial properties. Adjusting the formula and sintering temperature of the Cu-based binder can improve the interface strength.
PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS
(2022)
Article
Materials Science, Multidisciplinary
X. L. Ren, X. Y. Liu, S. Y. Shi, Y. P. Wang, N. Zhao
Summary: In this study, the morphologies of 8-Sn grains in different compositions of Sn-3.0Ag-0.5CuxIn solder balls and joints were characterized. Seven 8-Sn grain morphologies containing twinning relationship were found, and the 8-Sn grains were significantly refined when the In content exceeded 2wt%. Additionally, nucleus and growth models for the seven 8-Sn morphologies were established by combining the 8-Sn cell or cyclic twin structure with the preferred growth direction of 8-Sn dendrites.
MATERIALS CHARACTERIZATION
(2023)
Article
Nanoscience & Nanotechnology
Limeng Yin, Zhongwen Zhang, Zilong Su, Hehe Zhang, Cunguo Zuo, Zongxiang Yao, Gang Wang, Long Zhang, Yupeng Zhang
Summary: The addition of SiC can improve the wettability and tensile strength of low silver Sn-0.3Ag-0.7Cu composite solders, as well as decrease the thickness of IMC. However, when the SiC content exceeds a certain amount, the IMC grains begin to agglomerate and brittle phases appear, leading to a decrease in tensile strength.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
(2021)
Article
Engineering, Chemical
Cheng Chen, Cheng Wang, Huhao Sun, Hongbo Yin, Xiuli Gao, Hengxu Xue, Dahai Ni, Kan Bian, Qilin Gu
Summary: The effects of reflow cycles and aging time on the microstructure, growth behavior of intermetallic compounds, and mechanical properties of Sn-58Bi/ENEPIG solder joints were investigated. Pd-Au-Sn intermetallic compound was formed at the interface and grew gradually with increasing reflow cycles and aging time. The shear strength initially decreased and then increased after five reflow cycles. After 500 hours of aging at -40 degrees C, the shear strength decreased by approximately 12.3%. The fracture mode changed from ductile fracture to a mixed fracture with the increase in reflow cycles and aging time, due to the shift in fracture location from the solder matrix to the intermetallic compound interface.
Article
Chemistry, Physical
Yuanyuan Qiao, Haitao Ma, Ning Zhao
Summary: The study reported distinct uneven regional growth of interfacial Cu6Sn5 intermetallic compound in Cu/Sn-3.0Ag-0.5Cu/Cu micro solder joints under the influence of temperature gradient. The uneven growth was attributed to strong diffusion anisotropy of Cu atoms in beta-Sn grains, leading to variations in IMC thickness at different theta angles.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Engineering, Electrical & Electronic
Lei Sun, Liang Zhang, Yi Zhang, Ye-xiang Xu, Pei-xin Zhang, Qi-hao Liu, Hao-jie Shan
Summary: This research investigates the effect of adding nano-TiN particles to SAC0307 solder. The results show that the addition of nano-TiN can restrict the growth of intermetallic compounds and refine the microstructure of the solder, leading to improved wettability and mechanical properties.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Chemistry, Physical
Yuanyuan Qiao, Ning Zhao, Haitao Ma
Summary: The microstructure heredity of Cu/Sn-3.0Ag-0.5Cu(wt%)/Cu micro solder joints between sequential reflows was found to differ depending on the reflow method used, with temperature gradient reflow helping to maintain the preferred orientation structure of beta-Sn grains.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Engineering, Industrial
X. L. Ren, Y. P. Wang, X. Y. Liu, L. J. Zou, N. Zhao
Summary: This paper investigates the effects of cooling rate and solder ball size on the morphology and orientation of beta-Sn in Sn-based solder joints. Three different solidified morphologies were found in the solder balls/joints, and their formation was dependent on the solder ball size. Regardless of the nucleus model, the formation probability of large theta angle beta-Sn grains was proved to be higher than 77% and had little relationship with other factors.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
(2022)
Article
Chemistry, Physical
Dongdong Chen, Junhu Qin, Xin Zhang, Dongcheng Liang, Hailong Bai, Jianhong Yi, Jikang Yan
Summary: In this study, the interfacial structure and long-term increase of tensile strength in the intermetallic compounds between SnAg3Cu0.5 solder and Cu substrates were investigated. It was found that the thickness of the interface increased and became smooth after 200 hours of aging at 150 degrees C, leading to an enhanced tensile strength of the solder joints.
Article
Materials Science, Multidisciplinary
Qian Sun, Jie Wang, Xiao-Nan Wang, Xing-Wen Zhou, Xiao-Xia Tang, Kato Akira
Summary: The Cu aggregation in Sn-3.0Ag-0.5Cu/electroless nickel-immersion gold (ENIG) solder joints has a significant impact on the formation of intermetallic compounds (IMCs) at the interface. The study compared the interfacial microstructure of Sn-3.0Ag-0.5Cu/ENIG joints with Cu-free solder or substrate to determine the contribution of Cu and its metallurgical behavior. Scanning Electron Microscope (SEM) and Energy Dispersive Spectroscopy (EDS) were used to observe IMCs and elemental distribution. The results revealed that Cu aggregation occurred in the interface and was mainly contributed by the solder, while the ENIG substrate played a minor role. Cu6Sn5 was formed at the interface due to its lowest Gibbs free energy. These findings are important for controlling the interfacial microstructure and performance of solder joints.
Article
Materials Science, Multidisciplinary
Shuai Zhang, Shuye Zhang, Hongzhi Zhou, Kyung-Wook Paik, Tianran Ding, Weimin Long, Sujuan Zhong, Peng He
Summary: Microwave Hybrid Heating (MHH) is a promising method for material joining, allowing for selective and uniform heating. This experimental study focused on investigating the characteristics and reliability of joints made using nano-Sn-3.0Ag-0.5Cu soldering paste and MHH technique. The research findings showed that the shear strength of the joints reached its peak value under specific microwave power and exposure time, but decreased after thermal shock tests.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Peibin Ma, Mingyang Wang, Aiying Chen, Lijian Gu, Zhiyi Ding, Xiaogui Wang, Bin Gan
Summary: Nano-twinned boundaries in high-temperature alloys play a crucial role in regulating the distribution of nano-precipitates and enhancing mechanical properties.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Jiachen Zhang, Fan Lu, Xinxin Liu, Taiwen Huang, Rui Li, Changsheng Tan, Guojun Zhang, Lin Liu
Summary: This study investigates the effects of Re and Ta interactions on the precipitation of the TCP phase in experimental alloys under long-term thermal exposure. The study finds that microstructure segregation is not fully eliminated even with standard heat treatment, and the interaction between Re and Ta enhances the formation of the TCP phase. Thermodynamic calculations and first-principles analysis reveal that Re significantly improves the driving force of TCP phase precipitation. The study also observes a phase transition from the sigma-phase to the P-phase, with Ni playing a crucial role in the diffusion process.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Ronit Roy, Adil Shaik, Matthew Topping, Fei Long, Mark R. Daymond
Summary: This study demonstrates the improvements in characterizing localized dislocation distribution using the HR-EBSD method compared to the conventional approach. Two extreme examples of deformation conditions were investigated to show the efficacy of HR-EBSD in identifying dislocations and subtle features. The direct correlation between slip bands and HR-EBSD estimated GNDs is also presented, enhancing the scope of this approach in identifying individual slip bands.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Wenshan Guo, Hui Zhang, Qingjun Zhou, Guangchun Xiao, Ning Guo, Wei Zhao, Gang Wang
Summary: The microstructures and corrosion resistance of TC11 components were significantly improved using a high-power, high-speed laser metal deposition (LMD) process and subsequent post-heat treatment, with greater improvements observed in the deposition direction. The significant improvement of corrosion resistance in the deposition direction is mainly due to the weakening of the charged galvanic corrosion effect between the non-interlayer zone and interlayer zone.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Shuai Xu, Rui Cao, Junheng Gao, Yu Zhang, Haitao Zhao, Shuize Wang, Yuhe Huang, Guilin Wu, Honghui Wu, Chaolei Zhang, Xinping Mao
Summary: In this study, the microstructures and mechanical properties of interphase precipitation strengthening micro-alloyed steels were investigated. The addition of Cr was found to increase the yield strength without significant decrease of ductility. Thermodynamics analysis revealed that the addition of Cr led to grain refinement and decrease of sheet spacing of nanoprecipitates. Calculations showed that the decrease of interphase-precipitated carbides sheet spacing and the refinement of grain size were responsible for the strength enhancement of Cr microalloyed steel.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Zhaoxin Zhong, Biao Zhang, Yuhan Ren, Jian Ye, Jiawei Zhang, Feng Ye
Summary: In this study, bioinspired web-liked multiphase composites were successfully constructed using boron-modified polysilazane polymer. The composites consisted of long TiB nanowires as 'web' and hybrid TiC and Ti3Si particles as 'nodes'. The enhanced strength of these composites was attributed to the synergistic load transfer of the hybrid reinforcements. This study provides a promising design approach for developing high-performance composites with high reinforcement content, utilizing polymer instead of traditional ceramic powder.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Geng Liu, Linran Yu, Jie Su, Ran Ding, Min Xiong, Qi Gao
Summary: In this study, a flash austenitization heat treatment approach was used to achieve a dual-phase microstructure consisting of retained austenite and fine-grained ferrite in low-carbon TRIP steel. Phase-field simulations revealed the acceleration of ferrite transition kinetics in the Mn-depleted region and the influence of chemical heterogeneity of C and Mn on the stabilization of austenite.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Zhichao Yang, Dehui Zheng, Zhen Wang, Tingbin Liang, Shuangbao Wang
Summary: In this study, the configurations, formation process, and properties of the Cu-rich layer formed during TJE of Al alloys were revealed using aberration-corrected scanning TEM (STEM), STEM image simulations, and first-principles calculations. The results showed a new orientation relationship between the Cu-rich layer and Al matrix, and provided insights into the formation mechanisms of the Cu-rich layer and Cu diffusion zone.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Shuai Chen, Ruyu Tian, Jiayue Wen, Yanhong Tian
Summary: In this study, the interfacial microstructure evolution and reliability of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Ni and Cu/Sn-3.0Ag-0.5Cu-0.05TiO2 (SAC305-0.05TiO2)/Ni interconnections under thermal shock were investigated. The results showed that the addition of TiO2 nanoparticles can suppress the growth of interfacial IMCs and improve the reliability of the connections.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Yunbin Lu, Yangju Feng, Wei Wang, Wenke Wang, Jianlei Yang, Wenzhen Chen, Guorong Cui, Dongdong Zhuang, Hongyang Cao
Summary: In order to improve the wear resistance of titanium alloy, titanium matrix composites with network distributed TiBw were fabricated. The results showed that the wear rate of the composites decreased by 17.2% at room temperature and 38.4% at high temperature compared to the TA15 alloy. The TiBw in the composites enhanced work hardening, improved thermal conductivity, and effectively hindered dislocation movement and promoted dynamic recrystallization during high-temperature wear.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Jubert Pasco, Lu Jiang, Thomas Dorin, Ali Keshavarzkermani, Youliang He, Clodualdo Aranas Jr
Summary: The unique structure and solute distribution of CoCrMo alloys produced using Laser Powder Bed Fusion technique require custom heat-treating processes to achieve the targeted phase distribution and mechanical properties. This study investigates the phase transformation behavior and precipitate distribution of CoCrMo samples after aging heat treatment. The results show differences in phase fraction and nucleation sites between directly aged and solution heat-treated samples.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Zipeng Ma, Meng Zhou, Baohong Tian, Yi Zhang, Heng Li, Xu Li, Jin Zou, Haoyan Hu, Ke Jing, Yong Liu, Alex A. Volinsky
Summary: In this study, two electrical contact composites were prepared using the vacuum hot pressing sintering endo-oxidation method. The addition of Y2O3 had no negative effects on the electrical conductivity and hardness of the composites. Moreover, it reduced the welding force and arc energy, and improved the stability of the contacts.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Wei Sun, Ning Cui, Shuling Zhang, Tiewei Xu, Xiaopeng Wang, Fantao Kong
Summary: A laminated composite was successfully fabricated and its microstructure and mechanical properties were investigated. The composite exhibited high bonding strength, improved flexural strength and fracture toughness, and superior tensile properties compared to the monolithic alloy.
MATERIALS CHARACTERIZATION
(2024)
Article
Materials Science, Multidisciplinary
Zih-You Wu, Yin-Ku Lee, Su-Yueh Tsai, Po-Yu Chen, Jenq-Gong Duh
Summary: With the development of the artificial intelligence (AI) industries, electronic packaging is advancing towards high density, high efficiency, and multi-functionality. The application of microbumps is necessary to achieve high density and small-scale interconnection. In this study, three types of full intermetallic compounds (IMCs) bumps were fabricated, and the mechanical and thermal properties of IMCs were analyzed. The results showed that the full IMCs bumps with added Ni and Zn exhibited consistent structure and excellent thermal stability, providing a reliable microstructure for application.
MATERIALS CHARACTERIZATION
(2024)