Growth kinetics and thickness prediction of interfacial intermetallic compounds between solid steel and molten aluminum based on thermophysical simulation in a few seconds

Title
Growth kinetics and thickness prediction of interfacial intermetallic compounds between solid steel and molten aluminum based on thermophysical simulation in a few seconds
Authors
Keywords
Thermophysical simulation, Initial interface reaction, IMC, Solid steel and molten aluminum, Thermal cycle
Journal
MATERIALS CHARACTERIZATION
Volume 132, Issue -, Pages 413-421
Publisher
Elsevier BV
Online
2017-09-14
DOI
10.1016/j.matchar.2017.09.012

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