Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils

Synergistic effects of gelatin and convection on copper foil electrodeposition

(2016) Tingru Chang et al.   ELECTROCHIMICA ACTA

3-Mercapto-1-Propanesulfonate for Cu Electrodeposition Studied by in Situ Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy, Density Functional Theory Calculations, and Cyclic Voltammetry

(2015) Kevin G. Schmitt et al.   Journal of Physical Chemistry C

Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison

(2013) Chong Wang et al.   ELECTROCHIMICA ACTA

Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes

(2012) Yong-Da Chiu et al.   LANGMUIR

Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions

(2011) Yong-Da Chiu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of Additives and the Effect of Aging in Modifying Surface Topography of Electrodeposited Copper

(2009) R. Manu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Adsorption Behavior and Related Mechanism of Janus Green B during Copper Via-Filling Process

(2009) Ya-Bing Li et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The effect of hydrogen co-deposition on the morphology of copper electrodeposits. II. Correlation between the properties of electrolytic solutions and the quantity of evolved hydrogen

(2008) N.D. Nikolić et al.   JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Interactions of Chloride and 3-Mercapto-1-Propanesulfonic Acid in Acidic Copper Sulfate Electrolyte

(2008) Hung-Ming Chen et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The Synergistic Effects of Additives on Improving the Electroplating of Zinc under High Current Densities

(2008) Ju-Cheng Hsieh et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY