Thermal Analysis of High-Power Flip-Chip-Bonded Photodiodes

Title
Thermal Analysis of High-Power Flip-Chip-Bonded Photodiodes
Authors
Keywords
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Journal
JOURNAL OF LIGHTWAVE TECHNOLOGY
Volume 35, Issue 19, Pages 4242-4246
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2017-08-08
DOI
10.1109/jlt.2017.2736884

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